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Applicationï¼DDR5.jpg

2 Layers.jpg

Rigid Printed

Circuit Board

Micro SD Card PCB with Thick Gold
Plating Flash Gold and Selective Plating Soft Gold and Selective Plating Hard Gold
Min.Bonding Pad Size：3mil
Min.Conductor Width & Space：40um/40um

Micro SD Card PCB with Thick Gold.jpg

Layers：8 Layers
Surface Finish： ENIG/ENEPIG/OSP
Line Width & Space：90um/96um
Application：SSD Card

Layers：8 Layers.jpg

Layers：6 Layers（1+4+1）
Surface Finish： Plating Flash Gold and Hard Gold
Blind Via Solid Plating
Application：Smart Watch

Layers：6 Layers（1+4+1）.jpg

Line_Width_&_Spaceï¼35um.jpg

Line Width & Space：35um/35um
Surface Finish： ENEPIG
Application：MEMS

Layers：4 Layers
Surface Finish： ENEPIG
Application：Automotive Laser Radar

Layers：4 Layers.jpg

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